Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging
Intermetallic compound (IMC) plays great roles in connecting components to PCB boards, as well as die attach materials connecting chips to substrates. Cracks in IMC may leads to failure in an electronic product function. Therefore it is important to investigate the mechanical properties of the IMC t...
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| Main Authors: | , , , , |
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| Format: | |
| Published: |
2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5234 |
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| Institution: | Universiti Tenaga Nasional |