Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition
The effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method were studied in this paper. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were sele...
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| Main Authors: | , |
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| Published: |
2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5251 |
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| Institution: | Universiti Tenaga Nasional |
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