Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging
Intermetallic compound (IMC) growth behavior plays an important role in solder joint reliability of electronic packaging assemblies. The growth of interfacial IMC compounds and the interfacial voids/crack formation between Sn-25Ag-10Sb lead-free solders and Nickel plated Cu in power package subject...
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| Main Authors: | , , , |
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| Format: | |
| Published: |
2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5273 |
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| Institution: | Universiti Tenaga Nasional |