A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint
Eu RoHS Directive for environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag 1 and Sn-Ag-Cu 1 eutectic solders with melting temperatures of 221°C and 217°C, respectively are...
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| Main Authors: | , , , , , , |
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| Format: | |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5278 |
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| Institution: | Universiti Tenaga Nasional |