Selection of high strength encapsulant for MEMS devices undergoing high-pressure packaging
Deflection behavior of several encapsulant materials under uniform pressure was studied to determine the best outer encapsulant for MEMS device. Encapsulation is needed to protect movable parts of MEMS devices during high-pressure transfer molded packaging process. The selected outer encapsulant mat...
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| Main Authors: | , , , |
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| Format: | |
| Published: |
2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5283 |
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| Institution: | Universiti Tenaga Nasional |