Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)
The effect of temperature change to electrical resistivity of Aluminum bond pad (Al pad) on die surface of Under Bump Metallurgy (UBM) were discussed in this paper. Four categories of samples were involved in measurement; a sample without UBM and the samples with single, double and triple zincation...
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | |
| Published: |
2017
|
| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5329 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Universiti Tenaga Nasional |