Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack

Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack

Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultan...

Full description

Saved in:
Bibliographic Details
Main Authors: Mohd Nordin, Muhammad Haziq Iqmal, Hamzah, Khairum, Nik Long, Nik Mohd Asri, Khashi’ie, Najiyah Safwa, Waini, Iskandar, Zainal, Nurul Amira, Sayed Nordin, Sayed Kushairi
Format: Article
Published: Semarak Ilmu Publishing 2024
Online Access:http://psasir.upm.edu.my/id/eprint/106298/
https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4373
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Universiti Putra Malaysia

Internet

http://psasir.upm.edu.my/id/eprint/106298/
https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4373

Similar Items