Design and fabrication technique of thick-film circuits

This paper describes the stages in the design and fabrication of a hybrid circuit in thick-film technology. The material commonly used for thick-film circuit fabriation are also described. The use of CAD package greatly reduces the time required to develope the hybrid circuits.

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Bibliographic Details
Main Authors: Wagiran, Rahman, Yeop Majlis, Burhanuddin, Ramli, Abdul Rahman
Format: Conference or Workshop Item
Language:English
Published: 1990
Online Access:http://psasir.upm.edu.my/id/eprint/18064/1/ID%2018064.pdf
http://psasir.upm.edu.my/id/eprint/18064/
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Institution: Universiti Putra Malaysia
Language: English
Description
Summary:This paper describes the stages in the design and fabrication of a hybrid circuit in thick-film technology. The material commonly used for thick-film circuit fabriation are also described. The use of CAD package greatly reduces the time required to develope the hybrid circuits.