Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging

• Main Author: Dharmalingam, Sivakumar
• Format: Thesis
• Language: English
• Published: 2004
• Subjects: Microelectronic packaging - Total roduction maintenance - Case studies
• Online Access: http://psasir.upm.edu.my/id/eprint/5897/1/FK_2004_8%20IR.pdf; http://psasir.upm.edu.my/id/eprint/5897/
• Institution: Universiti Putra Malaysia

Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. TPM is designed to get maximum efficiency from the equipment while creating a satisfactory working environment. In Motorola, Selangor yield improvement had been an impor...