Application of artificial neural network for optimization the wet contact angle for lead free Bi-Ag soldering alloys

• Main Authors: Ghamarian, Nima, Mohamed Ariff, Azmah Hanim, Nahavandi, Mahdi, Zainal, Zulkarnain, Lim, Janet Hong Ngee
• Format: Conference or Workshop Item
• Language: English
• Published: 2015
• Online Access: http://psasir.upm.edu.my/id/eprint/66185/1/Application%20of%20artificial%20neural%20network%20for%20optimization%20the%20wet%20contact%20angle%20for%20lead%20free%20Bi-Ag%20soldering%20alloys.pdf; http://psasir.upm.edu.my/id/eprint/66185/
• Institution: Universiti Putra Malaysia

In recent years, electronic packaging provides significant research and development challenges across multiple disciplines such as performance, materials, reliability, thermals and interconnections. New technologies and techniques frequently adopted can be implemented in soldering alloys of semicond...