Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field

• Main Authors: Ruthramurthy, Balachandran, Yow, Ho Kwang, Ong, Boon Hoong, Ramasamy, Manickam, Kassim, Anuar, Teoh, Wah Tzu, Tan, Kar Ban
• Format: Conference or Workshop Item
• Language: English
• Published: IEEE 2008
• Online Access: http://psasir.upm.edu.my/id/eprint/69416/1/Surface%20morphology%20of%20Ni-Fe%20thin%20films%20grown%20on%20copper%20substrates%20using%20pulse%20electrodeposition%20in%20ultrasonic%20field.pdf; http://psasir.upm.edu.my/id/eprint/69416/
• Institution: Universiti Putra Malaysia

Nickel-Iron (Ni-Fe) thin films were pulse-electrodeposited on copper (Cu) substrates under galvanostatic mode in the presence/absence of an ultrasonic field. The as-prepared thin films were characterized by X-Ray Diffractometer (XRD) and Scanning Electron Microscopy (SEM). The XRD results confirmed...