Integration Of Dmaic Methodology And Capa Concept For Quality ImprovementIn Semiconductor Industry

The term quality in industry has been a key factor in measuring a firm competitiveness. Tools, methods, and concepts have been massively applied in improving and controlling product quality. Thus, industries urge themselves to cope with the needs of complete goods. In order to get a structured quali...

Full description

Saved in:
Bibliographic Details
Main Author: Harun, Nurul Aida
Format: Thesis
Language:English
Published: 2017
Subjects:
Online Access:http://eprints.usm.my/36425/1/NURUL_AIDA_BINTI_HARUN_24_Pages.pdf
http://eprints.usm.my/36425/
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Universiti Sains Malaysia
Language: English
id my.usm.eprints.36425
record_format eprints
spelling my.usm.eprints.36425 http://eprints.usm.my/36425/ Integration Of Dmaic Methodology And Capa Concept For Quality ImprovementIn Semiconductor Industry Harun, Nurul Aida TJ1-1570 Mechanical engineering and machinery The term quality in industry has been a key factor in measuring a firm competitiveness. Tools, methods, and concepts have been massively applied in improving and controlling product quality. Thus, industries urge themselves to cope with the needs of complete goods. In order to get a structured quality action, an organized framework is highly reliable. The purpose of this research is to develop a new problem solving framework where DMAIC (Define-Measure-Analyze-Improve-Control) is the main approach, with infusion of CAPA (Corrective and Preventive Action) concept. The DMAIC method is often described as an approach to problem-solving and a data-driven quality strategy as it is an integral part of the Six Sigma quality initiatives. Meanwhile, the CAPA concept is the systematic investigation of the root cause of identified risks or problems, widely implemented in industries. In this research, these two approaches are merged in designing a new quality reporting document named as the Quality Enhancement Action (QEA) report. The report presents the structured quality action in a more efficient way conducted in the electronics sector. The report has been validated through case studies and a survey through questionnaire. The outcomes confirmed the application and the practicality of the report as well as the new framework to improve quality issues. On the other hand, the quality report is not only focus on problem solving and decision making, but can break down organizational barriers. Through process and quality improvement, industries will have the capability in producing better goods in future. 2017 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/36425/1/NURUL_AIDA_BINTI_HARUN_24_Pages.pdf Harun, Nurul Aida (2017) Integration Of Dmaic Methodology And Capa Concept For Quality ImprovementIn Semiconductor Industry. Masters thesis, Universiti Sains Malaysia.
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic TJ1-1570 Mechanical engineering and machinery
spellingShingle TJ1-1570 Mechanical engineering and machinery
Harun, Nurul Aida
Integration Of Dmaic Methodology And Capa Concept For Quality ImprovementIn Semiconductor Industry
description The term quality in industry has been a key factor in measuring a firm competitiveness. Tools, methods, and concepts have been massively applied in improving and controlling product quality. Thus, industries urge themselves to cope with the needs of complete goods. In order to get a structured quality action, an organized framework is highly reliable. The purpose of this research is to develop a new problem solving framework where DMAIC (Define-Measure-Analyze-Improve-Control) is the main approach, with infusion of CAPA (Corrective and Preventive Action) concept. The DMAIC method is often described as an approach to problem-solving and a data-driven quality strategy as it is an integral part of the Six Sigma quality initiatives. Meanwhile, the CAPA concept is the systematic investigation of the root cause of identified risks or problems, widely implemented in industries. In this research, these two approaches are merged in designing a new quality reporting document named as the Quality Enhancement Action (QEA) report. The report presents the structured quality action in a more efficient way conducted in the electronics sector. The report has been validated through case studies and a survey through questionnaire. The outcomes confirmed the application and the practicality of the report as well as the new framework to improve quality issues. On the other hand, the quality report is not only focus on problem solving and decision making, but can break down organizational barriers. Through process and quality improvement, industries will have the capability in producing better goods in future.
format Thesis
author Harun, Nurul Aida
author_facet Harun, Nurul Aida
author_sort Harun, Nurul Aida
title Integration Of Dmaic Methodology And Capa Concept For Quality ImprovementIn Semiconductor Industry
title_short Integration Of Dmaic Methodology And Capa Concept For Quality ImprovementIn Semiconductor Industry
title_full Integration Of Dmaic Methodology And Capa Concept For Quality ImprovementIn Semiconductor Industry
title_fullStr Integration Of Dmaic Methodology And Capa Concept For Quality ImprovementIn Semiconductor Industry
title_full_unstemmed Integration Of Dmaic Methodology And Capa Concept For Quality ImprovementIn Semiconductor Industry
title_sort integration of dmaic methodology and capa concept for quality improvementin semiconductor industry
publishDate 2017
url http://eprints.usm.my/36425/1/NURUL_AIDA_BINTI_HARUN_24_Pages.pdf
http://eprints.usm.my/36425/
_version_ 1643708779897815040