Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates

Pencirian aloi pateri tanpa plumbum (Sn-9Zn, Sn-8Zn-3Bi dan Sn-3Ag-0.5Cu) ke atas substrat kumprum tanpa salutan dan yang disalut dengan Au-Ni telah dilakukan. Keputusan menunjukkan kebolehbasahan bagi ketiga-tiga aloi pateri ke atas substrat kuprum adalah baik pada suhu yang telah ditetapkan. Ukura...

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Main Author:	Binh, Duong Ngoc
Format:	Thesis
Language:	English
Published:	2009
Subjects:	TN1-997 Mining engineering. Metallurgy
Online Access:	http://eprints.usm.my/41512/1/Duong_Ngoc_Binh24.pdf http://eprints.usm.my/41512/
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Institution:	Universiti Sains Malaysia
Language:	English

id	my.usm.eprints.41512
record_format	eprints
spelling	my.usm.eprints.41512 http://eprints.usm.my/41512/ Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates Binh, Duong Ngoc TN1-997 Mining engineering. Metallurgy Pencirian aloi pateri tanpa plumbum (Sn-9Zn, Sn-8Zn-3Bi dan Sn-3Ag-0.5Cu) ke atas substrat kumprum tanpa salutan dan yang disalut dengan Au-Ni telah dilakukan. Keputusan menunjukkan kebolehbasahan bagi ketiga-tiga aloi pateri ke atas substrat kuprum adalah baik pada suhu yang telah ditetapkan. Ukuran sudut sentuh dan daya basahan menunjukkan pembasahan yang baik telah tercapai. Properties of lead free solder alloys (Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu) on Au-Ni surface finished copper and copper substrates were investigated. Results obtained showed good wetting of all three solder alloys on Au-Ni surface finished substrate at appropriate temperatures. Contact angle measurement and wetting force results reaffirmed that good wetting of solder alloys on substrate was achieved. 2009-11 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/41512/1/Duong_Ngoc_Binh24.pdf Binh, Duong Ngoc (2009) Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates. PhD thesis, Universiti Sains Malaysia.
institution	Universiti Sains Malaysia
building	Hamzah Sendut Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Sains Malaysia
content_source	USM Institutional Repository
url_provider	http://eprints.usm.my/
language	English
topic	TN1-997 Mining engineering. Metallurgy
spellingShingle	TN1-997 Mining engineering. Metallurgy Binh, Duong Ngoc Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
description	Pencirian aloi pateri tanpa plumbum (Sn-9Zn, Sn-8Zn-3Bi dan Sn-3Ag-0.5Cu) ke atas substrat kumprum tanpa salutan dan yang disalut dengan Au-Ni telah dilakukan. Keputusan menunjukkan kebolehbasahan bagi ketiga-tiga aloi pateri ke atas substrat kuprum adalah baik pada suhu yang telah ditetapkan. Ukuran sudut sentuh dan daya basahan menunjukkan pembasahan yang baik telah tercapai. Properties of lead free solder alloys (Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu) on Au-Ni surface finished copper and copper substrates were investigated. Results obtained showed good wetting of all three solder alloys on Au-Ni surface finished substrate at appropriate temperatures. Contact angle measurement and wetting force results reaffirmed that good wetting of solder alloys on substrate was achieved.
format	Thesis
author	Binh, Duong Ngoc
author_facet	Binh, Duong Ngoc
author_sort	Binh, Duong Ngoc
title	Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
title_short	Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
title_full	Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
title_fullStr	Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
title_full_unstemmed	Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
title_sort	interfacial reactions and electromigration in lead-free solder joints with copper and au-ni surface finished copper substrates
publishDate	2009
url	http://eprints.usm.my/41512/1/Duong_Ngoc_Binh24.pdf http://eprints.usm.my/41512/
_version_	1643710241183891456

Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates

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