Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
Due to the environmental concern for lead toxicity, the use of lead-free solder has been widespread in electronic packaging industries. In order for lead-free solder to replace the current lead solder, lead-free solder should have as close melting point as lead solder (1830C) and also has good wetta...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2011
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| Subjects: | |
| Online Access: | http://eprints.usm.my/43190/1/ABDUL%20KARIM%20ABDUL%20WAHAB.pdf http://eprints.usm.my/43190/ |
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| Institution: | Universiti Sains Malaysia |
| Language: | English |