Investigation Of The Fluid/Structure Interaction In Moulded Underfill Process
The rapid development of portable electronic devices, such as iPad, iPhone, iPod, and laptop, propels the integrated circuit (IC) packaging technology toward miniaturization characterized by high capacity and compactness of IC package. The scaling down of IC package size has given challenges to the...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2013
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| Subjects: | |
| Online Access: | http://eprints.usm.my/43379/1/Khor%20Chu%20Yee24.pdf http://eprints.usm.my/43379/ |
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| Institution: | Universiti Sains Malaysia |
| Language: | English |