The Effect Of Adding Silver Nanoparticles In Tin Surface Finish Electroplated With Ultrasonication On Wettability And Strength Of SAC305 Solder Joint
The development of electronic packaging has introduced various types of surface finish on copper substrate to improve bonding performance of solder. This affects the soldering and the intermetallic compound that formed at the solder/substrate interface which eventually influence the reliability of...
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| Main Author: | |
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| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2022
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| Subjects: | |
| Online Access: | http://eprints.usm.my/56648/1/The%20Effect%20Of%20Adding%20Silver%20Nanoparticles%20In%20Tin%20Surface%20Finish%20Electroplated%20With%20Ultrasonication%20On%20Wettability%20And%20Strength%20Of%20SAC305%20Solder%20Joint_Tneh%20Kin%20Man.pdf http://eprints.usm.my/56648/ |
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| Institution: | Universiti Sains Malaysia |
| Language: | English |