Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering
Consumer electronics market is one of the fastest growing markets in the world. Flip chip (FC) technology is one of the technologies for interconnecting semiconductor devices, and with the demand for shrinking in footprint of electronic packages, FC technology must handle the increase in I/O interco...
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| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2019
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| Online Access: | http://eprints.usm.my/58414/1/Influence%20Of%20Copper%20Pillar%20Bump%20Structure%20On%20Flip%20Chip%20Packaging%20During%20Reflow%20Soldering.pdf http://eprints.usm.my/58414/ |
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| Institution: | Universiti Sains Malaysia |
| Language: | English |