Analysis Of Plastic Encapsulation Process In 3D IC Package With Through-Silicon Via (Tsv) Technology
Through-silicon via (TSV) technology has been an emerging technology to 3D heterogeneous system integration through vertical interconnection. This promising technology enables smaller footprints, reduced signal delay, shorter interconnections, lower power consumption and higher integration densit...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2013
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| Subjects: | |
| Online Access: | http://eprints.usm.my/61078/1/24%20Pages%20from%20Pages%20from%2000001780128.pdf http://eprints.usm.my/61078/ |
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| Institution: | Universiti Sains Malaysia |
| Language: | English |