Application Of Taguchi Method With The Interaction Test For Lower DIBL IN WSix/TiO2 Channel Vertical Double Gate NMOS

The poly-Si/SiO2 based MOSFETs have been encountering a problem with the limitation of channel length for the device miniaturization. The drain induced barrier lowering (DIBL) effect is the main threat for the device to acquire excellent device’s characteristics. Thus, the metal-gate/high-k techno...

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Main Authors: Khairil Ezwan, Kaharudin, Fauziyah, Salehuddin, Anis Suhaila, Mohd Zain, Muhammad Nazirul Ifwat, Abd Aziz, I., Ahmad
Format: Article
Language:English
Published: Asian Research Publishing Network (ARPN) 2016
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Online Access:http://eprints.utem.edu.my/id/eprint/17097/1/Application%20Of%20Taguchi%20Method%20With%20The%20Interaction%20Test%20For%20Lower%20DIBL%20IN%20WSix%20TiO2%20Channel%20Vertical%20Double%20Gate%20NMOS.pdf
http://eprints.utem.edu.my/id/eprint/17097/
http://www.arpnjournals.org/jeas/research_papers/rp_2016/jeas_0616_4395.pdf
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Institution: Universiti Teknikal Malaysia Melaka
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spelling my.utem.eprints.170972021-09-08T23:58:13Z http://eprints.utem.edu.my/id/eprint/17097/ Application Of Taguchi Method With The Interaction Test For Lower DIBL IN WSix/TiO2 Channel Vertical Double Gate NMOS Khairil Ezwan, Kaharudin Fauziyah, Salehuddin Anis Suhaila, Mohd Zain Muhammad Nazirul Ifwat, Abd Aziz I., Ahmad T Technology (General) The poly-Si/SiO2 based MOSFETs have been encountering a problem with the limitation of channel length for the device miniaturization. The drain induced barrier lowering (DIBL) effect is the main threat for the device to acquire excellent device’s characteristics. Thus, the metal-gate/high-k technology is a smart choice for the future replacement of poly-Si/SiO2 channel. This paper introduces the implementation of WSix/TiO2 channel to replace the poly-Si/SiO2 channel in vertical double-gate NMOS structure, followed by the application of Taguchi method to reduce the drain induced barrier lowering (DIBL) effects. The device was virtually fabricated and characterized by using both ATHENA and ATLAS modules of SILVACO TCAD tools. The L12 orthogonal array, main effects, signal-to noise ratio (SNR) and analysis of variance (ANOVA) were utilized to analyze the effect of process parameter variations on the DIBL. Later, the interactions between the process parameters were investigated by using L8 orthogonal array of Taguchi method. Based on the final results, halo implant tilt angle and source/drain (S/D) implant energy were identified as the most dominant process parameters where each of them contributes 24% and 16% of factor effects on SNR respectively. The lowest possible value of DIBL after the optimization with the interaction test is 1.552 mV/V. Asian Research Publishing Network (ARPN) 2016-06 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/17097/1/Application%20Of%20Taguchi%20Method%20With%20The%20Interaction%20Test%20For%20Lower%20DIBL%20IN%20WSix%20TiO2%20Channel%20Vertical%20Double%20Gate%20NMOS.pdf Khairil Ezwan, Kaharudin and Fauziyah, Salehuddin and Anis Suhaila, Mohd Zain and Muhammad Nazirul Ifwat, Abd Aziz and I., Ahmad (2016) Application Of Taguchi Method With The Interaction Test For Lower DIBL IN WSix/TiO2 Channel Vertical Double Gate NMOS. ARPN Journal Of Engineering And Applied Sciences, 11 (11). pp. 7093-7103. ISSN 1819-6608 http://www.arpnjournals.org/jeas/research_papers/rp_2016/jeas_0616_4395.pdf
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
topic T Technology (General)
spellingShingle T Technology (General)
Khairil Ezwan, Kaharudin
Fauziyah, Salehuddin
Anis Suhaila, Mohd Zain
Muhammad Nazirul Ifwat, Abd Aziz
I., Ahmad
Application Of Taguchi Method With The Interaction Test For Lower DIBL IN WSix/TiO2 Channel Vertical Double Gate NMOS
description The poly-Si/SiO2 based MOSFETs have been encountering a problem with the limitation of channel length for the device miniaturization. The drain induced barrier lowering (DIBL) effect is the main threat for the device to acquire excellent device’s characteristics. Thus, the metal-gate/high-k technology is a smart choice for the future replacement of poly-Si/SiO2 channel. This paper introduces the implementation of WSix/TiO2 channel to replace the poly-Si/SiO2 channel in vertical double-gate NMOS structure, followed by the application of Taguchi method to reduce the drain induced barrier lowering (DIBL) effects. The device was virtually fabricated and characterized by using both ATHENA and ATLAS modules of SILVACO TCAD tools. The L12 orthogonal array, main effects, signal-to noise ratio (SNR) and analysis of variance (ANOVA) were utilized to analyze the effect of process parameter variations on the DIBL. Later, the interactions between the process parameters were investigated by using L8 orthogonal array of Taguchi method. Based on the final results, halo implant tilt angle and source/drain (S/D) implant energy were identified as the most dominant process parameters where each of them contributes 24% and 16% of factor effects on SNR respectively. The lowest possible value of DIBL after the optimization with the interaction test is 1.552 mV/V.
format Article
author Khairil Ezwan, Kaharudin
Fauziyah, Salehuddin
Anis Suhaila, Mohd Zain
Muhammad Nazirul Ifwat, Abd Aziz
I., Ahmad
author_facet Khairil Ezwan, Kaharudin
Fauziyah, Salehuddin
Anis Suhaila, Mohd Zain
Muhammad Nazirul Ifwat, Abd Aziz
I., Ahmad
author_sort Khairil Ezwan, Kaharudin
title Application Of Taguchi Method With The Interaction Test For Lower DIBL IN WSix/TiO2 Channel Vertical Double Gate NMOS
title_short Application Of Taguchi Method With The Interaction Test For Lower DIBL IN WSix/TiO2 Channel Vertical Double Gate NMOS
title_full Application Of Taguchi Method With The Interaction Test For Lower DIBL IN WSix/TiO2 Channel Vertical Double Gate NMOS
title_fullStr Application Of Taguchi Method With The Interaction Test For Lower DIBL IN WSix/TiO2 Channel Vertical Double Gate NMOS
title_full_unstemmed Application Of Taguchi Method With The Interaction Test For Lower DIBL IN WSix/TiO2 Channel Vertical Double Gate NMOS
title_sort application of taguchi method with the interaction test for lower dibl in wsix/tio2 channel vertical double gate nmos
publisher Asian Research Publishing Network (ARPN)
publishDate 2016
url http://eprints.utem.edu.my/id/eprint/17097/1/Application%20Of%20Taguchi%20Method%20With%20The%20Interaction%20Test%20For%20Lower%20DIBL%20IN%20WSix%20TiO2%20Channel%20Vertical%20Double%20Gate%20NMOS.pdf
http://eprints.utem.edu.my/id/eprint/17097/
http://www.arpnjournals.org/jeas/research_papers/rp_2016/jeas_0616_4395.pdf
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