Micro-Drilling Of Silicon Wafer By Industrial CO2 Laser

Micro-Drilling Of Silicon Wafer By Industrial CO2 Laser

-

Saved in:
Bibliographic Details
Main Authors: Subramonian, Sivarao, Kasim, Mohd Shahir, Md Ali, Mohd Amran, Raja Abdullah, Raja Izamshah, Anand, T Joseph Sahaya
Format: Article
Language:English
Published: SPRINGER 2015
Subjects:
T Technology (General)
TA Engineering (General). Civil engineering (General)
Online Access:http://eprints.utem.edu.my/id/eprint/18983/2/45%20IJMME%2010.pdf
http://eprints.utem.edu.my/id/eprint/18983/
http://ijmme.springeropen.com/articles/10.1186/s40712-015-0029-8
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Universiti Teknikal Malaysia Melaka
Language: English

Internet

http://eprints.utem.edu.my/id/eprint/18983/2/45%20IJMME%2010.pdf
http://eprints.utem.edu.my/id/eprint/18983/
http://ijmme.springeropen.com/articles/10.1186/s40712-015-0029-8

Similar Items