Xrd Analysis Of Cu-Ai Interconnerct Intermetallic Compound In An Annealed Micro-Chip

• Main Authors: Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Hng, May Ting, Lee, Cher Chia
• Format: Conference or Workshop Item
• Language: English
• Published: 2012
• Subjects: T Technology (General); TA Engineering (General). Civil engineering (General)
• Online Access: http://eprints.utem.edu.my/id/eprint/20186/1/XRD%20ANALYSIS%20OF%20CU-AI%20INTERCONNECT%20INTERMETALLIC%20COMPOUND%20IN%20AN%20ANNEALED%20MICRO-CHIP-KOK%20YAU%20CHUA-MAK%2000353%20RAF.pdf; http://eprints.utem.edu.my/id/eprint/20186/
• Institution: Universiti Teknikal Malaysia Melaka

Cu-A1 intermetallic compound (IMC) in Cu wire-A1 bond pad interconnect interface is drawing attention of researches. However, due to thin IMC thickness, the characterizations of the IMC are limited to expensive and time consuming techniques. An evaluation is performed to use common X-Ray Diffraction...