Repair Of Ultrasonic Machining Induced Surface/Subsurface Cracks By Laser Irradiation

In ultrasonic machining (USM),a mirror-like surface cannot be readily obtained on hard and brittle materials owing to easily generated microcracks.This drawback greatly limits the utilisation of USM as a finish machining technology.Therefore,minimizing the crack size or even eliminating the cracks...

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Main Authors: Pay, Jun Liew, Jingsi, Wang
Format: Article
Language:English
Published: Elsevier Ltd 2019
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Online Access:http://eprints.utem.edu.my/id/eprint/22966/2/LAser%20Jingsi.pdf
http://eprints.utem.edu.my/id/eprint/22966/
https://www.sciencedirect.com/science/article/pii/S0030399218310399
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Institution: Universiti Teknikal Malaysia Melaka
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spelling my.utem.eprints.229662021-08-29T18:01:12Z http://eprints.utem.edu.my/id/eprint/22966/ Repair Of Ultrasonic Machining Induced Surface/Subsurface Cracks By Laser Irradiation Pay, Jun Liew Jingsi, Wang T Technology (General) TJ Mechanical engineering and machinery In ultrasonic machining (USM),a mirror-like surface cannot be readily obtained on hard and brittle materials owing to easily generated microcracks.This drawback greatly limits the utilisation of USM as a finish machining technology.Therefore,minimizing the crack size or even eliminating the cracks is necessary to improve surface quality.In this study,fine abrasive particles are first applied to minimize the crack size during USM. Material removal efficiency and surface quality are then evaluated.However,crack formation during this process is unavoidable,and microcracks left on the machined surface cannot be completely removed by merely decreasing the particle size.In addition,minimizing the particle size is not beneficial to maintaining a desired machining rate. Therefore,a new method to repair the cracks by laser irradiation is proposed.The USM machined surfacesm of glass plates are irradiated by a carbon dioxide laser at a wavelength of 10.6 μm to repair the cracks because glass has a high absorption coefficient at this wavelength.The temperature field generated during this process is evaluated using the finite element method. Simulation and experimental results demonstrate that the scanning speed of the laser beam has a considerable effect on the temperature increase,thereby influencing the repair result accordingly.Finally,a smoothed surface without cracks is obtained under a scanning speed of 300 mm/min and 5 W power.The combination of micro-USM and laser irradiation exhibits great potential for fabricating various micro-shapes and structures on hard and brittle materials,such as glass with high efficiency, high form precision and high surface quality. Elsevier Ltd 2019 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/22966/2/LAser%20Jingsi.pdf Pay, Jun Liew and Jingsi, Wang (2019) Repair Of Ultrasonic Machining Induced Surface/Subsurface Cracks By Laser Irradiation. Optics & Laser Technology, 111. pp. 497-508. ISSN 0030-3992 https://www.sciencedirect.com/science/article/pii/S0030399218310399 DOI: 10.1016/j.optlastec.2018.10.029
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
topic T Technology (General)
TJ Mechanical engineering and machinery
spellingShingle T Technology (General)
TJ Mechanical engineering and machinery
Pay, Jun Liew
Jingsi, Wang
Repair Of Ultrasonic Machining Induced Surface/Subsurface Cracks By Laser Irradiation
description In ultrasonic machining (USM),a mirror-like surface cannot be readily obtained on hard and brittle materials owing to easily generated microcracks.This drawback greatly limits the utilisation of USM as a finish machining technology.Therefore,minimizing the crack size or even eliminating the cracks is necessary to improve surface quality.In this study,fine abrasive particles are first applied to minimize the crack size during USM. Material removal efficiency and surface quality are then evaluated.However,crack formation during this process is unavoidable,and microcracks left on the machined surface cannot be completely removed by merely decreasing the particle size.In addition,minimizing the particle size is not beneficial to maintaining a desired machining rate. Therefore,a new method to repair the cracks by laser irradiation is proposed.The USM machined surfacesm of glass plates are irradiated by a carbon dioxide laser at a wavelength of 10.6 μm to repair the cracks because glass has a high absorption coefficient at this wavelength.The temperature field generated during this process is evaluated using the finite element method. Simulation and experimental results demonstrate that the scanning speed of the laser beam has a considerable effect on the temperature increase,thereby influencing the repair result accordingly.Finally,a smoothed surface without cracks is obtained under a scanning speed of 300 mm/min and 5 W power.The combination of micro-USM and laser irradiation exhibits great potential for fabricating various micro-shapes and structures on hard and brittle materials,such as glass with high efficiency, high form precision and high surface quality.
format Article
author Pay, Jun Liew
Jingsi, Wang
author_facet Pay, Jun Liew
Jingsi, Wang
author_sort Pay, Jun Liew
title Repair Of Ultrasonic Machining Induced Surface/Subsurface Cracks By Laser Irradiation
title_short Repair Of Ultrasonic Machining Induced Surface/Subsurface Cracks By Laser Irradiation
title_full Repair Of Ultrasonic Machining Induced Surface/Subsurface Cracks By Laser Irradiation
title_fullStr Repair Of Ultrasonic Machining Induced Surface/Subsurface Cracks By Laser Irradiation
title_full_unstemmed Repair Of Ultrasonic Machining Induced Surface/Subsurface Cracks By Laser Irradiation
title_sort repair of ultrasonic machining induced surface/subsurface cracks by laser irradiation
publisher Elsevier Ltd
publishDate 2019
url http://eprints.utem.edu.my/id/eprint/22966/2/LAser%20Jingsi.pdf
http://eprints.utem.edu.my/id/eprint/22966/
https://www.sciencedirect.com/science/article/pii/S0030399218310399
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