Effect Of Contact Pad’s Roughness And Ni–P Plating Thickness On Leadless Packages’ Shear Strength Variation
Studies on shear strength of thin small leadless packages (TSLP) focused predominantly on solder and refow factors. Contact pad’s surface roughness (Ra) and Ni–P thickness factors, though rather important, have not been reported widely. Thus, the current study investigates the efect of TSLP’s contac...
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Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
The Korean Institute of Electrical and Electronic Material Engineers
2020
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Online Access: | http://eprints.utem.edu.my/id/eprint/24642/2/LAU2020.PDF http://eprints.utem.edu.my/id/eprint/24642/ https://link.springer.com/article/10.1007/s42341-020-00218-8 |
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Institution: | Universiti Teknikal Malaysia Melaka |
Language: | English |