Optimization Of Copper Via Filling Process For Flexible Printed Circuit Using Response Surface Methodology
Copper filling is a method for 3D stacked packaging and has been widely used in the semiconductor industry. However, as the downsizing of devices becomes an unavoidable trend, the tolerance of flexible printed circuit (FPC) fabrication has to decrease, resulting in high failure rates. To solve this...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit UTeM
2020
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| Online Access: | http://eprints.utem.edu.my/id/eprint/25234/2/FINAL%20COPY-COMPRESSED%20%281%29.PDF http://eprints.utem.edu.my/id/eprint/25234/ https://jamt.utem.edu.my/jamt/article/view/5935/3898 |
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| Institution: | Universiti Teknikal Malaysia Melaka |
| Language: | English |