Bonding Material Enhancement For Surface Mount Component On Plastic Assembly

Bonding Material Enhancement For Surface Mount Component On Plastic Assembly

This project is about formulating and characterizing the electrically conductive adhesive (ECA) as eco-friendly, lead-free interconnect materials. This project aims to identify an optimum formulation of the ECA when using epoxy as a matrix with multiwalled carbon nanotube (MWCNT) as the conductive f...

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Bibliographic Details
Main Authors: Sheikh Md. Fadzullah, Siti Hajar, Omar, Ghazali, Mustafa, Zaleha, Hasan, Rafidah, Mohd Noh, Mohd Syahrin Amri, Wu, Jonathan, Samsudin, Zambri
Format: Technical Report
Language:English
Published: UTeM 2019
Online Access:http://eprints.utem.edu.my/id/eprint/25482/1/Bonding%20Material%20Enhancement%20For%20Surface%20Mount%20Component%20On%20Plastic%20Assembly.pdf
http://eprints.utem.edu.my/id/eprint/25482/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=118469
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Institution: Universiti Teknikal Malaysia Melaka
Language: English

Internet

http://eprints.utem.edu.my/id/eprint/25482/1/Bonding%20Material%20Enhancement%20For%20Surface%20Mount%20Component%20On%20Plastic%20Assembly.pdf
http://eprints.utem.edu.my/id/eprint/25482/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=118469

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