Optimization of glass transition temperature and pot life of epoxy blends using response surface methodology (RSM)

• Main Authors: Junid, Ramli, Endot, Nor Azam, Siregar, Januar Parlaungan, Abd Razak, Jeefferie, Wilkinson, Arthur N.
• Format: Article
• Language: English
• Published: MDPI 2021
• Online Access: http://eprints.utem.edu.my/id/eprint/25967/2/POLYMERS-13-03304.PDF; http://eprints.utem.edu.my/id/eprint/25967/; https://www.mdpi.com/2073-4360/13/19/3304; https://doi.org/10.3390/polym13193304
• Institution: Universiti Teknikal Malaysia Melaka

The aim of this work was to improve the processability of triglycidyl‐p‐aminophenol (TGPAP) epoxy resin. To achieve this improvement, a diluent, the diglycidyl ether of bisphenol F (DGEBF or BPF), was added to TGPAP, and the blended epoxy was then cured with 4, 4′‐diamino‐diphenyl sulfones (DDS). A response surface methodology (RSM) was used, with the target re‐sponse being to achieve a blended resin with a high glass transition temperature (Tg) and maximum pot life (or processing window, PW). Characterization through dynamic mechanical thermal analysis (DMTA) and using a rheometer indicated that the optimum formulation was obtained at 55.6 wt.% of BPF and a stoichiometric ratio of 0.60. Both values were predicted to give Tg at 180 °C and a processing window of up to 136.1 min. The predicted values were verified, with the obtained Tg and processing window (PW) being 181.2 ± 0.8 °C and 140 min, respectively, which is close to the values predicted using the RSM.