Optimization of copper(I) thiocyanate as hole transport material for solar cell by scaps-1D numerical analysis
In SSDSSC, various key parameters of CuSCN as HTM were explored using SCAPS-1D simulation software. A layer thickness of 3 µm with a moderate value of interface defect density was obtained yielding 2.56% of PCE in SSDSSC. TiO2 ETM and Ni back contact was found to be the best combination with CuSCN H...
Saved in:
Main Authors: | , , , , , |
---|---|
Format: | Article |
Language: | English |
Published: |
Przegląd Elektrotechniczny
2022
|
Online Access: | http://eprints.utem.edu.my/id/eprint/26789/2/24.PDF http://eprints.utem.edu.my/id/eprint/26789/ http://pe.org.pl/articles/2022/6/24.pdf |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Universiti Teknikal Malaysia Melaka |
Language: | English |