Microstructural characterization of pressureless sintered silver die attached material
Sintered silver (Ag) is one of the most promising interconnect materials for high power electronics applications due to its ability to withstand high temperature exceeding 250 °C while in operation.In this thesis, themicrostructural evolutions of spherical and flake types pressureless sintered Ag di...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English English |
| Published: |
2022
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/26950/1/Microstructural%20characterization%20of%20pressureless%20sintered%20silver%20die%20attached%20material.pdf http://eprints.utem.edu.my/id/eprint/26950/2/Microstructural%20characterization%20of%20pressureless%20sintered%20silver%20die%20attached%20material.pdf http://eprints.utem.edu.my/id/eprint/26950/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122148 |
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| Institution: | Universiti Teknikal Malaysia Melaka |
| Language: | English English |
Internet
http://eprints.utem.edu.my/id/eprint/26950/1/Microstructural%20characterization%20of%20pressureless%20sintered%20silver%20die%20attached%20material.pdfhttp://eprints.utem.edu.my/id/eprint/26950/2/Microstructural%20characterization%20of%20pressureless%20sintered%20silver%20die%20attached%20material.pdf
http://eprints.utem.edu.my/id/eprint/26950/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122148