Formulation for multiple cracks problem in thermoelectric-bonded materials using hypersingular integral equations

Formulation for multiple cracks problem in thermoelectric-bonded materials using hypersingular integral equations

New formulations are produced for problems associated with multiple cracks in the upper part of thermoelectric-bonded materials subjected to remote stress using hypersingular integral equations (HSIEs). The modified complex stress potential function method with the continuity conditions of the resul...

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Bibliographic Details
Main Authors: Hamzah, Khairum, Mohd Nordin, Muhammad Haziq Iqmal, Khashi’ie, Najiyah Safwa, Waini, Iskandar, Nik Long, Nik Mohd Asri, Fitri, Saadatul
Format: Article
Language:English
Published: MDPI AG 2023
Online Access:http://eprints.utem.edu.my/id/eprint/27491/2/0215302082023280.PDF
http://eprints.utem.edu.my/id/eprint/27491/
https://www.mdpi.com/2227-7390/11/14/3248
https://doi.org/10.3390/math11143248
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Institution: Universiti Teknikal Malaysia Melaka
Language: English

Internet

http://eprints.utem.edu.my/id/eprint/27491/2/0215302082023280.PDF
http://eprints.utem.edu.my/id/eprint/27491/
https://www.mdpi.com/2227-7390/11/14/3248
https://doi.org/10.3390/math11143248

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