Electrical effects of GNP/Ag/SA conductive epoxy on copper flexible substrate

Various efforts to improve the performance of printed conductive ink have been conducted in order to obtain its full performance potential. This includes the investigation on the effect of conductive filler particle size towards the electrical conductivity performance. This study focuses on the prod...

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Main Authors: Salim, Mohd Azli, Hussin, Hazril Hisham, Masripan, Nor Azmmi, Akop, Mohd Zaid, Md. Saad, Adzni, Wayne, Chew Kit, Photong, Chonlatee, Dai, Feng
Format: Article
Language:English
Published: Semarak Ilmu Publishing 2024
Online Access:http://eprints.utem.edu.my/id/eprint/27843/2/012111907202410553.pdf
http://eprints.utem.edu.my/id/eprint/27843/
https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5817/5266
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Institution: Universiti Teknikal Malaysia Melaka
Language: English
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spelling my.utem.eprints.278432024-10-09T16:37:25Z http://eprints.utem.edu.my/id/eprint/27843/ Electrical effects of GNP/Ag/SA conductive epoxy on copper flexible substrate Salim, Mohd Azli Hussin, Hazril Hisham Masripan, Nor Azmmi Akop, Mohd Zaid Md. Saad, Adzni Wayne, Chew Kit Photong, Chonlatee Dai, Feng Various efforts to improve the performance of printed conductive ink have been conducted in order to obtain its full performance potential. This includes the investigation on the effect of conductive filler particle size towards the electrical conductivity performance. This study focuses on the product condition and electrical performance of graphene nanoplatelet (GNP), silved nano particle (Ag) and silver acetate (SA) as hybrid conductive filler components by varying the particle size of only one the filler component, which is GNP. The GNP/Ag/SA formulation with organic solvent was used by preparing three samples utilizing different GNP particle sizes of 5 µm and 25 µm. The purpose of this experiment is to collect data on the electrical conductivity of ink when employed in circuits and determine the best formulation of conductive ink. The obtained results revealed differences between the inks produced using 5 µm and 25 µm of GNP sizes. The resistivity of the 5 µm samples were was lower than 25 µm samples. The GNP of 5 µm recorded the lowest resistivity of 2.48 x 10-5 Ω.m as compared to 2.63 x 10-5 Ω.m recorded by 25 µm samples. The lower resistivity value indicates that the conductive ink formulated using 5 µm of GNP size has better electrical conductivity performance. The results signify that by using different particle sizes of only one component of hybrid conductive fillers produced different conductive ink performance, especially the electrical conductivity. Semarak Ilmu Publishing 2024-06 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/27843/2/012111907202410553.pdf Salim, Mohd Azli and Hussin, Hazril Hisham and Masripan, Nor Azmmi and Akop, Mohd Zaid and Md. Saad, Adzni and Wayne, Chew Kit and Photong, Chonlatee and Dai, Feng (2024) Electrical effects of GNP/Ag/SA conductive epoxy on copper flexible substrate. Journal of Advanced Research in Applied Mechanics, 119 (1). pp. 13-26. ISSN 2289-7895 https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5817/5266 10.37934/aram.119.1.1326
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
description Various efforts to improve the performance of printed conductive ink have been conducted in order to obtain its full performance potential. This includes the investigation on the effect of conductive filler particle size towards the electrical conductivity performance. This study focuses on the product condition and electrical performance of graphene nanoplatelet (GNP), silved nano particle (Ag) and silver acetate (SA) as hybrid conductive filler components by varying the particle size of only one the filler component, which is GNP. The GNP/Ag/SA formulation with organic solvent was used by preparing three samples utilizing different GNP particle sizes of 5 µm and 25 µm. The purpose of this experiment is to collect data on the electrical conductivity of ink when employed in circuits and determine the best formulation of conductive ink. The obtained results revealed differences between the inks produced using 5 µm and 25 µm of GNP sizes. The resistivity of the 5 µm samples were was lower than 25 µm samples. The GNP of 5 µm recorded the lowest resistivity of 2.48 x 10-5 Ω.m as compared to 2.63 x 10-5 Ω.m recorded by 25 µm samples. The lower resistivity value indicates that the conductive ink formulated using 5 µm of GNP size has better electrical conductivity performance. The results signify that by using different particle sizes of only one component of hybrid conductive fillers produced different conductive ink performance, especially the electrical conductivity.
format Article
author Salim, Mohd Azli
Hussin, Hazril Hisham
Masripan, Nor Azmmi
Akop, Mohd Zaid
Md. Saad, Adzni
Wayne, Chew Kit
Photong, Chonlatee
Dai, Feng
spellingShingle Salim, Mohd Azli
Hussin, Hazril Hisham
Masripan, Nor Azmmi
Akop, Mohd Zaid
Md. Saad, Adzni
Wayne, Chew Kit
Photong, Chonlatee
Dai, Feng
Electrical effects of GNP/Ag/SA conductive epoxy on copper flexible substrate
author_facet Salim, Mohd Azli
Hussin, Hazril Hisham
Masripan, Nor Azmmi
Akop, Mohd Zaid
Md. Saad, Adzni
Wayne, Chew Kit
Photong, Chonlatee
Dai, Feng
author_sort Salim, Mohd Azli
title Electrical effects of GNP/Ag/SA conductive epoxy on copper flexible substrate
title_short Electrical effects of GNP/Ag/SA conductive epoxy on copper flexible substrate
title_full Electrical effects of GNP/Ag/SA conductive epoxy on copper flexible substrate
title_fullStr Electrical effects of GNP/Ag/SA conductive epoxy on copper flexible substrate
title_full_unstemmed Electrical effects of GNP/Ag/SA conductive epoxy on copper flexible substrate
title_sort electrical effects of gnp/ag/sa conductive epoxy on copper flexible substrate
publisher Semarak Ilmu Publishing
publishDate 2024
url http://eprints.utem.edu.my/id/eprint/27843/2/012111907202410553.pdf
http://eprints.utem.edu.my/id/eprint/27843/
https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/5817/5266
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