APPLICATION of TOTAL PRODUCTIVE MAINTENANCE to REDUCE NON-STICK ON PAD PROBLEM in a SEMICONDUCTOR INDUSTRY

• Main Author: Sivakumar, Dhar Malingam
• Format: Conference or Workshop Item
• Language: English
• Published: 2004
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utem.edu.my/id/eprint/4312/1/TPM-ICAMT_2004.pdf; http://eprints.utem.edu.my/id/eprint/4312/
• Institution: Universiti Teknikal Malaysia Melaka

Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. In the participating semiconductor company one of the TPM pillars, which is Focus Improvement activity was employed to improve yield. The team focused on Non Stick on Pa...