Microstructural and mechanical analysis of Cu and Au interconnect on various bond pads
Effects of High Temperature Storage (HTS) and bonding toward microstructure change of intermetallic compound (IMC) at the wire bonding interface of 3 types of bond pad (Al, AlSiCu and NiPdAu) were presented in this paper. Optical and electron microscope analyses revealed that the IMC growth rate of...
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Main Authors: | , , , , |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2013
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Subjects: | |
Online Access: | http://eprints.utem.edu.my/id/eprint/9145/1/30_CAP_13.pdf http://eprints.utem.edu.my/id/eprint/9145/ http://www.journals.elsevier.com/current-applied-physics |
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Institution: | Universiti Teknikal Malaysia Melaka |
Language: | English |