A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing
Semiconductor device leads were previously plated with Lead (Pb). Due to environmental concern, the plating material has been switched to Tin (Sn). However, due to the softness of Tin element plating, it often wears off and its residues deposited to the surface of the contacts used in semiconduct...
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Penerbit UTeM
2011
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| Online Access: | http://eprints.utem.edu.my/id/eprint/9193/1/jmet.vol3.no1.fullpaper1.pdf http://eprints.utem.edu.my/id/eprint/9193/ http://jmet.utem.edu.my/index.php?option=com_docman&task=cat_view&gid=56&Itemid=40 |
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my.utem.eprints.91932015-05-28T04:02:13Z http://eprints.utem.edu.my/id/eprint/9193/ A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing Ong, K.Y. SAID, MD RADZAI TJ Mechanical engineering and machinery Semiconductor device leads were previously plated with Lead (Pb). Due to environmental concern, the plating material has been switched to Tin (Sn). However, due to the softness of Tin element plating, it often wears off and its residues deposited to the surface of the contacts used in semiconductor device testing. As a result, significant drop of contact performance has been observed. This study intends to find out a theoretical explanation to the problem of tin deposition. As soon as the root cause is identified, studies go into the details of how to solve this problem. One of the economical suggestions is to apply lubricants on the contact. A theoretical calculation is derived to verify if the lubricant would significantly altered the overall resistance. Penerbit UTeM 2011-01 Article PeerReviewed application/pdf en http://eprints.utem.edu.my/id/eprint/9193/1/jmet.vol3.no1.fullpaper1.pdf Ong, K.Y. and SAID, MD RADZAI (2011) A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing. Journal of Mechanical Engineering and Technology, 3 (1). pp. 1-9. ISSN 2180-1053 http://jmet.utem.edu.my/index.php?option=com_docman&task=cat_view&gid=56&Itemid=40 |
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TJ Mechanical engineering and machinery Ong, K.Y. SAID, MD RADZAI A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing |
| description |
Semiconductor device leads were previously plated with Lead (Pb). Due to
environmental concern, the plating material has been switched to Tin (Sn).
However, due to the softness of Tin element plating, it often wears off and
its residues deposited to the surface of the contacts used in semiconductor
device testing. As a result, significant drop of contact performance has been
observed. This study intends to find out a theoretical explanation to the
problem of tin deposition. As soon as the root cause is identified, studies
go into the details of how to solve this problem. One of the economical
suggestions is to apply lubricants on the contact. A theoretical calculation
is derived to verify if the lubricant would significantly altered the overall
resistance. |
| format |
Article |
| author |
Ong, K.Y. SAID, MD RADZAI |
| author_facet |
Ong, K.Y. SAID, MD RADZAI |
| author_sort |
Ong, K.Y. |
| title |
A Study on the Deposition of Tin on the
Contac ts Subjected to High Frequency Impac t
Loading in Semiconductor Device Testing |
| title_short |
A Study on the Deposition of Tin on the
Contac ts Subjected to High Frequency Impac t
Loading in Semiconductor Device Testing |
| title_full |
A Study on the Deposition of Tin on the
Contac ts Subjected to High Frequency Impac t
Loading in Semiconductor Device Testing |
| title_fullStr |
A Study on the Deposition of Tin on the
Contac ts Subjected to High Frequency Impac t
Loading in Semiconductor Device Testing |
| title_full_unstemmed |
A Study on the Deposition of Tin on the
Contac ts Subjected to High Frequency Impac t
Loading in Semiconductor Device Testing |
| title_sort |
study on the deposition of tin on the
contac ts subjected to high frequency impac t
loading in semiconductor device testing |
| publisher |
Penerbit UTeM |
| publishDate |
2011 |
| url |
http://eprints.utem.edu.my/id/eprint/9193/1/jmet.vol3.no1.fullpaper1.pdf http://eprints.utem.edu.my/id/eprint/9193/ http://jmet.utem.edu.my/index.php?option=com_docman&task=cat_view&gid=56&Itemid=40 |
| _version_ |
1665905390487863296 |