Interfacial reaction between SAC3807 lead-free solders and different copper substrate via reflow soldering process

Interfacial reaction between SAC3807 lead-free solders and different copper substrate via reflow soldering process

The different composition material of copper substrate significantly affects the intermetallic compound (IMC) formation and the solder joints durability. This study was conducted on the interfacial reaction between lead-free solder and the different copper substrates via reflow soldering. The s...

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Bibliographic Details
Main Authors: Fauzi, Muhamad Razizy, Amiruddin, Nurul Amira, Osman, Saliza Azlina, Mohamed Anuar, Rabiatul Adawiyah
Format: Article
Language:English
Published: Trans Tech Publications 2022
Subjects:
T Technology (General)
Online Access:http://eprints.uthm.edu.my/7168/1/P13799_ca974b0f5af06ec4a8dad91f88901bfc.pdf
http://eprints.uthm.edu.my/7168/
https://doi.org/10.4028/p-s3b2n1
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Institution: Universiti Tun Hussein Onn Malaysia
Language: English

Internet

http://eprints.uthm.edu.my/7168/1/P13799_ca974b0f5af06ec4a8dad91f88901bfc.pdf
http://eprints.uthm.edu.my/7168/
https://doi.org/10.4028/p-s3b2n1

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