Temperature and strain-rate dependent damage-based models for lead-free solder interconnects
Microelectronic packages with ball grid array (BGA) solder interconnects are subjected to thermomechanical load cycles during fabrication and throughout service life. The lead-free solder joints of BGA respond to both temperature and strain-rate depends on the exposed temperature cycles. Consequentl...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2021
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/102081/1/SitiFaizahMadPSKM2021.pdf http://eprints.utm.my/id/eprint/102081/ http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:147314 |
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| Institution: | Universiti Teknologi Malaysia |
| Language: | English |