Effects of copper additives on load carrying capacity and micro mechanisms of fracture in 3D-printed PLA specimens

• Main Authors: Sadeghian, Hadi, Ayatollahi, Majid R., Yahya, Mohd. Yazid
• Format: Article
• Published: Elsevier Ltd 2023
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/107416/; http://dx.doi.org/10.1016/j.tafmec.2023.104027
• Institution: Universiti Teknologi Malaysia

This study deals with the effects of employing copper additives on the fracture resistance and fracture micro-mechanisms of 3D-printed Polylactic Acid (PLA) specimens under mixed mode I/II loading. Several comparative fracture tests are conducted on pre-cracked Semi-Circular Bend (SCB) specimens made of pure PLA and particulate copper-reinforced PLA (PLA/Cu) printed using the Fused Deposition Modeling (FDM) technique. The SCB specimens are fabricated in three different layer orientations. The comparison of the experimental results reveals that employing copper additives increases the load carrying capacities (LCCs) of the pre-cracked SCB specimens with the flat, on-edge, and upright layer orientations by 2.9%, 15.5%, and 27.7%, respectively. In addition, to determine the tensile properties of two desired materials, dogbone specimens made of PLA and PLA/Cu in three different layer orientations are fabricated and tested. The experimental results obtained from the characterization tests similarly indicate that the presence of copper additives in 3D printed PLA specimens increases ultimate tensile strength by 15.9%, 14%, and, 10.4% in the three flat, on-edge, and upright layer orientations, respectively. Aside from performing experimental tests, the LCCs of pre-cracked specimens are predicted theoretically by utilizing Equivalent Material Concept (EMC) combined with the well-known Average Strain Energy Density (ASED) criterion. It is shown that the EMC-ASED criterion can estimate accurately the experimental LCCs of both FDM-PLA and FDM-PLA/Cu specimens. Finally, the Scanning Electron Microscope (SEM) technique is employed to provide a better understanding of the effects of copper additives on the micro-mechanisms of fracture.