Hybrid experimental-computational approach for solder/IMC interface shear strength determination in tin-lead solder joints

• Main Authors: Tamin, Mohd N., M. Nor, Fethma, Wei, Keat Loh
• Format: Conference or Workshop Item
• Published: 2007
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/14102/; http://ieeexplore.ieee.org/document/5585732/
• Institution: Universiti Teknologi Malaysia

Damage-based models for solder/intermetallics (IMC) interface often require the interface properties such as tensile and shear strengths. The minute size of the solder joint renders direct experimental determination of these properties impractical. This paper presents a hybrid experimental-computati...