Damage mechanics model for solder/intermetallics interface fracture process in solder joints
The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined using finite element (FE) method. The interface decohesion is described using a traction-separation quadratic failure criterion along with a mixed-mode displacement formulation for the interface fractu...
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| Main Authors: | , , |
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| Format: | Article |
| Published: |
Trans Tech Publications Inc.
2011
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/28853/ http://dx.doi.org/10.4028/www.scientific.net/KEM.462-463.1409 |
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| Institution: | Universiti Teknologi Malaysia |