Recipe generation of under fill process based on improved kernel regression and particle swarm optimization
The under fill process is a process that fills the gap between a chipset and a substrate using an epoxy material. The output of this process is a length of tongue that has to be controlled so it avoid touching the keep out zone. A recipe generation of the input parameters in the under fill process w...
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Format: | Thesis |
Language: | English |
Published: |
2012
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Online Access: | http://eprints.utm.my/id/eprint/33404/5/MohdHafizOthmanMFKE2012.pdf http://eprints.utm.my/id/eprint/33404/ http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:70202?site_name=Restricted Repository |
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Institution: | Universiti Teknologi Malaysia |
Language: | English |