Development of vapor pressure in FR4-copper composite material during solder reflow process

• Main Authors: Kamsah, Nazri, Tamin, Mohd. Nasir, Mohamed Kamar, Haslinda, Lahuri, Hidayatunnur, Wagiman, Amir Nur Rashid
• Format: Book Section
• Published: American Institute of Physics 2012
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/35239/; http://dx.doi.org/10.1063/1.4704209
• Institution: Universiti Teknologi Malaysia

This paper presents a finite element (FE) methodology for predicting the distribution of vapor pressure in a simple FR4-copper composite material when it is heated up to 215°C. A general purpose finite element software was used to develop a two-dimensional plane strain model of the composite materia...