Damage mechanics model for solder/intermetallic interface fracture process in solder joint
The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined using finite element (FE) method. The interface decohesion is described using a traction-separation quadratic failure criterion along with a mixed-mode displacement formulation for the interface fractu...
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Published: |
Scientific.Net
2011
|
| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/44828/ http://dx.doi.org/10.4028/www.scientific.net/KEM.462-463.1409 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Universiti Teknologi Malaysia |