Effect of different aging temperatures on interfacial reaction between SAC305 and enepig surface finish
In electronic packaging industry, they are now driven technology to green product by replacing leaded-solder with lead-free solder in order to fulfill the European Restriction of Hazardous Substance (RoHS) compliance. Thus, Sn-Ag-Cu lead-free solder family is one of candidates can fulfill this requi...
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| Main Authors: | , , , |
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| Format: | Article |
| Published: |
2012
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/46849/ http://dx.doi.org/10.4028/www.scientific.net/AMR.415-417.1181 |
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| Institution: | Universiti Teknologi Malaysia |