Effect of multiple reflow on IMC formation using various surface finishes
In this paper, the results of a study on the effect of multiple reflow on the mechanism of intermetallic compounds (IMCs) formation of solder joints made from lead–free Sn–4Ag–0.5Cu (SAC405) on electroless nickel/electroless palladium/immersion gold (ENEPIG), electroless nickel/immersion gold (ENIG)...
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| Main Authors: | , |
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| Format: | Article |
| Published: |
2012
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/46860/ http://dx.doi.org/10.1504/IJMMP.2012.051230 |
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| Institution: | Universiti Teknologi Malaysia |