Thermal analysis of staggered pin fin heat sink for central processing unit

• Main Authors: Mohd. Annuar, Khalil Azha, Mohd. Ab. Halim, Mohamad Firdaus, Ismail, Fatimah Sham, Zahari, Madiha, Johari, Siti Halma, Harun, Mohamad Haniff
• Format: Article
• Published: AJBAS 2015
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utm.my/id/eprint/60494/
• Institution: Universiti Teknologi Malaysia

The advancement of microelectronics technology in producing high clock speed and power density’s central processor unit (CPU) indirectly related to thermal management issue. This is a major challenge to the manufacturers, designers and researchers to find the optimum design of the cooling system. If...