Effects of non-spherical colloidal silica slurry on Al-NiP hard disk substrate CMP application
Spherical and non-spherical colloidal silica size and shape were characterized and its effects on aluminum alloy nickel plated (Al-NiP) hard disk substrate during chemical mechanical polishing (CMP) was investigated. Non-spherical colloidal silica slurry shows significantly higher material removal r...
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| Main Authors: | , , |
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| Format: | Article |
| Published: |
Elsevier B. V.
2016
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/69333/ http://dx.doi.org/10.1016/j.apsusc.2015.10.169 |
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| Institution: | Universiti Teknologi Malaysia |