Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product
Market demand on system-on-chip (SoC) using ball-attach technologies, it is time for ball-attach module to have an improvement on their capabilities within limited resources (man and machine). This paper identifies caused of factor which contributes more time to production time. Justification on imp...
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2016
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| Online Access: | http://eprints.utm.my/id/eprint/71717/1/AnnuarIsmail2016_FactorsIdentificationonOptimizationofBallPlacement.pdf http://eprints.utm.my/id/eprint/71717/ https://www.scopus.com/inward/record.uri?eid=2-s2.0-84952332773&doi=10.11113%2fjt.v78.4278&partnerID=40&md5=09eba8933e29df2472011b5385689f0b |
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my.utm.717172017-11-21T03:28:06Z http://eprints.utm.my/id/eprint/71717/ Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product Ismail, A. Dolah, R. Miyagi, Z. T Technology (General) Market demand on system-on-chip (SoC) using ball-attach technologies, it is time for ball-attach module to have an improvement on their capabilities within limited resources (man and machine). This paper identifies caused of factor which contributes more time to production time. Justification on improving ball-attach module cycle time during high volume activities is explained. Penerbit UTM Press 2016 Article PeerReviewed application/pdf en http://eprints.utm.my/id/eprint/71717/1/AnnuarIsmail2016_FactorsIdentificationonOptimizationofBallPlacement.pdf Ismail, A. and Dolah, R. and Miyagi, Z. (2016) Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product. Jurnal Teknologi, 78 (1). pp. 175-179. ISSN 0127-9696 https://www.scopus.com/inward/record.uri?eid=2-s2.0-84952332773&doi=10.11113%2fjt.v78.4278&partnerID=40&md5=09eba8933e29df2472011b5385689f0b |
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T Technology (General) Ismail, A. Dolah, R. Miyagi, Z. Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product |
| description |
Market demand on system-on-chip (SoC) using ball-attach technologies, it is time for ball-attach module to have an improvement on their capabilities within limited resources (man and machine). This paper identifies caused of factor which contributes more time to production time. Justification on improving ball-attach module cycle time during high volume activities is explained. |
| format |
Article |
| author |
Ismail, A. Dolah, R. Miyagi, Z. |
| author_facet |
Ismail, A. Dolah, R. Miyagi, Z. |
| author_sort |
Ismail, A. |
| title |
Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product |
| title_short |
Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product |
| title_full |
Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product |
| title_fullStr |
Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product |
| title_full_unstemmed |
Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product |
| title_sort |
factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product |
| publisher |
Penerbit UTM Press |
| publishDate |
2016 |
| url |
http://eprints.utm.my/id/eprint/71717/1/AnnuarIsmail2016_FactorsIdentificationonOptimizationofBallPlacement.pdf http://eprints.utm.my/id/eprint/71717/ https://www.scopus.com/inward/record.uri?eid=2-s2.0-84952332773&doi=10.11113%2fjt.v78.4278&partnerID=40&md5=09eba8933e29df2472011b5385689f0b |
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