Simulating damage mechanics of electromigration and thermomigration
Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical reliability issues for next generation nanoelectronics and power electronics. The purpose of this project is to develop a computational tool for simulating damage mechanics of EM and TM and their intera...
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| Main Authors: | , , |
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| Format: | Article |
| Published: |
Society for Computer Simulation International, San Diego, Ca., USA
2008
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/8602/ http://dx.doi.org/10.1177/0037549708094856 |
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| Institution: | Universiti Teknologi Malaysia |