Thermal performance analysis in sinusoidal-cavities-ribs microchannel heat sink with secondary channel geometry for low pumping power application

The increases in the demand for high performance electronic device has led cooling technology from air cooling to liquid cooling method in order to prevent the operating temperature in the electronic device goes beyond the junction temperature of the electronic device. Liquid as a heat transportatio...

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Bibliographic Details
Main Authors: Japar, W. M. A. A., Sidik, N. A. C., Saidur, R., Asako, Y., Muhammad, N. M.
Format: Conference or Workshop Item
Language:English
Published: 2020
Subjects:
Online Access:http://eprints.utm.my/id/eprint/92162/1/YAsako2020_ThermalPerformanceAnalysisinSinusoidalCavitiesRibs.pdf
http://eprints.utm.my/id/eprint/92162/
http://dx.doi.org/10.1088/1757-899X/884/1/012087
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Institution: Universiti Teknologi Malaysia
Language: English