Microwave dielectric analysis on adhesive disbond in acrylic glass (poly (methyl methacrylate)) at Ku-band

• Main Authors: Cheng, E. M., Mohd. Afendi, R., Shahriman, A. B., Razlan, Z. M., You, K. Y., Nashrul Fazli, M. N., Mohd. Shukry, A. M., Khairul Salleh, B., Ridzuan, M. J. M., Beh, C. Y., Khor, S. F.
• Format: Article
• Published: Asian Research Publishing Network 2020
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utm.my/id/eprint/93098/; http://www.arpnjournals.com/jeas/volume_19_2020.htm
• Institution: Universiti Teknologi Malaysia

A microwave dielectric spectroscopy for detecting adhesive disbonds between acrylic glass (aka Poly (methyl methacrylate)) was discussed. The adhesive bond was developed using epoxy resin and acrylate. The level of joint disbond can be quantified using Young Modulus. In this work, the strength of bo...