Effect of laser parameters on sequential laser beam micromachining and micro electro-discharge machining

• Main Authors: Noor Rashid, Mir Akmam, Saleh, Tanveer, Noor, Wazed Ibne, Mohamed Ali, Mohamed Sultan
• Format: Article
• Published: Springer Science and Business Media Deutschland GmbH 2021
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utm.my/id/eprint/95232/; http://dx.doi.org/10.1007/s00170-021-06908-8
• Institution: Universiti Teknologi Malaysia

Laser beam micromachining (LBMM) and micro electro-discharge machining (µEDM) based sequential micromachining technique, LBMM-µEDM, has drawn significant research attention to utilize the advantages of both methods, i.e., LBMM and µEDM. In this process, a pilot hole is machined by the LBMM, and subsequently finishing operation of the hole is carried out by the µEDM. This paper presents an experimental investigation on the stainless steel (type SS304) to observe the effects of laser input parameters (namely, laser power, scanning speed, and pulse frequency) on the performance of the finishing technique, that is, the µEDM in this case. The scope of the work is limited to 1-D machining, i.e., drilling microholes. It was found that laser input parameters mainly scanning speed and power influenced the output performance of µEDM significantly. Our study suggests that if an increased scanning speed at a lower laser power is used for the pilot hole drilling by the LBMM process, it could result in significantly slower µEDM machining time. On the contrary, if the higher laser power is used with even the highest scanning speed for the pilot hole drilling, then µEDM processing time was faster than the previous case. Similarly, µEDM time was also quicker for LBMMed pilot holes machined at low laser power and slow scanning speed. Our study confirms that LBMM-µEDM-based sequential machining technique reduces the machining time, tool wear, and instability (in terms of short circuit count) by a margin of 2.5 x, 9 x, and 40 x, respectively, in contrast to the pure µEDM process without compromising the quality of the holes.